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Laterally structured ultrathin polymer films attached to solid surfaces can be obtained using photolithographic techniques developed for electronic device fabrication. The Figure shows a surface plasmon (SP) microscopy image of a structured polystyrene (PS) film of 21.5 nm thickness prepared by photopolymerization. The authors report a strong adhesion of the polymer films to the substrate due to covalent linking.
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Prucker et al. (1998) studied this question.
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