Review of the thermal contact conductance of junctions with metalliccoatings and films

The reliability of standard electronic modules may be improved by decreasing overall module temperature. This may be accomplished by enhancing the thermal contact conductance at the interface between the module frame guide rib and the card rail to which the module is clamped. The surface irregularities resulting from the machining or extruding of the components cause the true contact area to be much less than the apparent contact area, increasing the contact resistance. Some metallic coatings deform easily under load and increase the contact area and associated conductance. This investigation evaluates possible coatings and determines those most suitable for enhancing contact conductance based upon predictions using existing theories for thermal contact conductance of coated junctions.