Measurements of the linear growth rate of white tin into thin single-crystal wafers of gray tin, over the temperature range 24.2° to 46.5°C, are presented. The rate is not a single-valued function of the temperature. Imposed upon the strong temperature dependence of the average rate is a variation which is well defined at a given temperature; the spread in the observed values decreases sharply with increasing temperature. The variation is attributed to two observed stress-relaxation processes: cleavage in the gray tin and plastic deformation, accompanied by recrystallization, in the white tin.
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Wolfson et al. (1960) studied this question.
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