Wafer-level in-registry microstamping

Microstamping is an inexpensive technique that allows for micrometer-scale patterning of a rich variety of materials by a replication procedure based on an elastomeric stamp. We have investigated the scalability of microstamping for its use in the fabrication of microelectromechanical systems. Until now, the application of microstamping to multilayer processing at a wafer level has been impaired by the flexibility of the stamp. By mounting the stamp onto a rigid glass surface, we demonstrate the feasibility of in-registry multilayer microstamping at a 4-in wafer level.