Electromigration in a single crystalline submicron width aluminum interconnection

Electromigration properties in a single crystalline submicron width aluminum interconnection formed on Si(111) have been examined by resistance change measurements and in situ observations using scanning electron microscopy. It was observed that single crystalline aluminum has an extremely high resistance to electromigration-induced open circuit failures, when compared to polycrystalline copper and aluminum. The mechanism for the high resistance is considered to be a large activation energy, resulting from lattice diffusion. A tendency for void formation to become parallel to the longitudinal direction of the interconnection assisted the life time prolongation.