Analysis for Modeling Electromagnetic Characteristics of Via in High-Speed Printed Circuit Board

In this paper, firstly, full-wave electromagnetic simulation software is employed to analyze vertical via, influences of via radius, stub, pad and anti-pad radius on Signal Integrity (SI) are studied. And then, the equivalent circuit model for through via is established and the model RLC parameters are extracted based on the two-port network admittance parameter theory. On the basis of this, empirical model of via at high frequency and its model parameter extraction method is given. Finally, simulation and comparison verify the effectiveness of the equivalent circuit model. The results prove that the modeling method and parameter extraction are effective and practical for via electromagnetic characteristics analysis, and applicable to through via without stub when the frequency is less than 7.5GHz.