The first stages of plastic deformation of FZ silicon single crystals were investigated by in situ synchrotron radiation topography, in creep conditions at temperatures between 975 and 1075 K and applied stresses from 22 to 44 MPa. Silicon samples were initially dislocation-free and deformation started at Vickers indentations and surface damage. Several features relevant for dislocation multiplication were observed: cross-slip in the bulk as well as near the surface, development of prismatic half-loops, non-planar development of dislocations in slip bands, in the wake of leading segments.
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Vallino et al. (2000) studied this question.
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