New silicon‐containing polyimides have been prepared by the reaction of pyromellitic dianhydride (PMDA) and 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA) with organosilicon diisocyanates having the following general structure: magnified image where R1 = R2 = CH3 and C6H5. Thermal properties of these polyimides were studied were by TG, DTA, and DTG.
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Ghatge et al. (1983) studied this question.
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