This study reports the synthesis of new silicon‐containing amide, benzimidazole hydrazide, and oxadiazole polymers. Procedures are described for the preparation of several intermediate compounds. The silicon‐containing polymers are soluble in organic solvents. Solution‐cast films from the polymers generally are flexible and exhibit good adhesion to glass and metal surfaces. Preliminary examination indicates that the polymers are heat‐stable at elevated temperatures.
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Kovacs et al. (1968) studied this question.
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