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March 1, 1995Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena

Directional deposition of Cu into semiconductor trench structures using ionized magnetron sputtering

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Authors

PCPeter F. ChengJet Propulsion LaboratorySRS. M. RossnagelUniversity of VirginiaDRD. N. RuzicArgonne National Laboratory

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Cite This Study

Cheng et al. (1995) studied this question.

synapsesocial.com/papers/6a8931eb3d6e0fcd7a28c8dfhttps://doi.org/10.1116/1.587998
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