Influence of deep RIE tolerances on comb-drive actuator performance

This paper analyses the various etching tolerances and profiles of comb-drive microstructures by using deep reactive ion etching (RIE) and studies their influence on the actuator's performance. The comb-drive actuators studied in this paper are fabricated with the silicon-on-glass (SOG) wafer process using deep RIE and wafer bonding, which present very high-aspect-ratio and high-strength microstructures. However, the deep RIE process generates some tolerances and varies the dimension and profile of comb fingers and flexures due to the process limitations. We have analysed the different etching tolerances and studied their influence on the actuator's performance, in terms of the electrostatic force, flexure stiffness, actuator's displacement, air damping and quality factor of the actuator. The analysis shows that the comb fingers with a positive slope profile generated a larger electrostatic force, and the flexures with a negative profile induced the loss of the actuator's stiffness. The combination of these two profiles leads to a great increase in the actuator's displacement and decrease in the quality factor. The measured results of the SOG fabricated actuators have demonstrated the influence of deep RIE tolerance on the actuator's performance.