Growth of InGaN/GaN light-emitting devices on nonpolar or semipolar planes offers a viable approach to reducing or eliminating the issues associated with polarization-related electric fields present in c -plane III-nitride heterostructures. Although progress in device performance has been rapid since the introduction of high-quality free-standing nonpolar and semipolar GaN substrates, a full appreciation of the materials challenges unique to nonpolar and semipolar III-nitride semiconductors has been slower to emerge. Only recently have researchers begun to understand issues such as the origins of the pyramidal hillocks typically observed on nominally on-axis m -plane GaN films, the effects of m -plane substrate misorientation on surface morphology and device performance, the mechanics of anisotropic cracking in tensile strained m -plane AlGaN films, the formation of basal-plane stacking faults in long-wavelength m -plane InGaN quantum wells, and the mechanisms for stress relaxation in semipolar AlGaN and InGaN films. In this paper, we review the materials and growth issues unique to high-performance nonpolar and semipolar light-emitting devices grown on high-quality free-standing GaN substrates and provide an outlook for the opportunities and challenges that lie ahead.
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Farrell et al. (2012) studied this question.
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