Synapse
⌘+K
Synapse
PulseExploreClubsResearchersJournals
Instagram
HomeClubsExplore
May 1, 1997IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Thermosonic bonding of an optical transceiver based on an 8×8 vertical cavity surface emitting laser array

View Full Paper
Ask AI
Bookmark
Share

Authors

TMT. McLarenSKSa Yoon KangWZWenge ZhangYellow River Institute of Hydraulic Research

Discussion

Loading...

Member takes

Implication

Key Points

Key points are not available for this paper at this time.

Cite This Study

McLaren et al. (1997) studied this question.

synapsesocial.com/papers/6a89695240fe6a3effcb0682https://doi.org/10.1109/96.575567
View Full Paper
Ask AI
Bookmark
Share

Also Consider

Synapse has enriched one closely related paper. Consider it for comparative context:

  1. 1LED array modules by new technology microbump bonding method1990 · 54 citations