A significant challenge in the fabrication of thin-film (<1 µm) Au MEMS devices is maintaining planarity after removal of the sacrificial layer. Out-of-plane deformations are driven by residual stress gradients in the Au films. It was found that the baking time and temperature of the sacrificial photoresist layer, as well as the thermal history once the Au was deposited, combined to determine the stress gradient within the Au film. In this technical note we provide the complete details of the optimized procedures to fabricate planar thin-film Au devices with unattached ends that are characterized by low residual stresses.
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Stanec et al. (2007) studied this question.
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