Buckling‐Driven Transfer Printing Through Selectively Bonded Strip‐Matrix Structure

Transfer printing has emerged as an essential strategy for integrating high‐performance micro‐ and nanoscale devices onto compliant substrates for flexible electronics. However, existing transfer printing techniques based on elastomeric stamps still suffer from several limitations, including limited adhesion switchability, reliance on complex external stimuli, and high process complexity. Here, a facile buckling‐driven non‐contact transfer printing technique is proposed, in which thin strips are selectively bonded to an elastomeric matrix. Lateral compression induces controllable buckling of these strips, not only yielding significant adhesion switchability for reversible and adhesion‐independent printing, but also enabling programmable and curved‐substrate printing through the design of discrete bonding sites between the strips and the matrix. The underlying mechanism is systematically elucidated through theoretical and experimental studies. Finally, inks with diverse geometries are integrated onto substrates with challenging surface properties and complex morphologies, and a flexible light‐emitting diode array with programmable display is further fabricated, demonstrating the significant potential of this technique for deterministic assembly in flexible electronics.