Localized electro-deposition (LED): the march toward process development

Development issues required to advance localized electro-deposition for integration with commercial fabrication techniques are presented through both experimental demonstrations and theoretical modelling of the various aspects of the process. The process is a potential candidate solution for challenges facing current fabrication technologies, and definitely has great potential for post-processing and rapid prototyping applications, especially when considering high aspect ratio structures. The various interactions determining the process mechanisms and rate are well understood through mass transfer modes as demonstrated by the agreement between simulation and experimental results of the deposition profile evolution under various process conditions. The process compatibility for integration with current commercial fabrication processes as well as automation is high. Up-to-date demonstration of the process resolution suggests suitability for many applications requiring structures with micron and possibly submicron scale dimensions, but would require further development to achieve nanometre resolution. It is concluded that the achievement of foreseen developments requires collaboration of interdisciplinary efforts.