Non‐Relief‐Pattern Lithography Patterning of Solution Processed Organic Semiconductors

Patterning of solution processed organic semiconductors demonstrated using a non-relief-pattern, photoresist-free, lithographic process with a self-assembled monolayer (SAM) patterned by deep ultraviolet (DUV) irradiation. The patterned, low-surface-energy SAM then steers the organic semiconductor solution into areas where the SAM has been removed by the DUV exposure resulting in organic semiconductor microstructures with good resolution.