The measurement of thin film stress using phase shifting interferometry

A new technique for determining the stress of thin films is described. This technique combines digital phase shifting interferometry with image-processing software. A circular disc polished on one side is used as the coated substrate during film deposition. The average stress in thin films can be derived by comparing the deflection of the substrate before and after film deposition. The deflection of the substrate by the deposited film is obtained by the phase map. Using the Zernike polynomial fitting algorithm, a three-dimensional contour map is generated from the polynomial coefficients to visualize the deformation of the thin film and to examine the tensile or compressive stress after film deposition. Four oxide films prepared by ionbeam sputter deposition are investigated for their film stresses. The experimental results show that the stress values are concordant with measurements using other methods.