Michelson interferometer for deformation measurements in an UHV system at elevated temperatures

An interferometric device is described, which permits deformation measurements and observation of small changes of shape in samples under UHV conditions and in the temperature range 20–400 °C. Adjustment during operation can be made by a simple mechanism with the use of only one single flexible UHV connection (stainless steel bellows). The interferometer was used to investigate the origin of stresses in thin Ni films and the stress relaxation during annealing by means of the ’’bending-plate method.’’