We propose a novel technique for organizing steps on Si surfaces. Arrays of small holes are formed on Si(111) wafers misoriented toward [112̄] by using conventional Si technology. The wafers are then annealed in an ultra-high vacuum at about 1300° C. During the hole filling-in process, steps on the surface are arranged regularly, and finally parallel step bands are ordered after the holes have completely disappeared.
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Ogino et al. (1995) studied this question.
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