Answers are grounded in this paper and cite their sources.
Thermal stress due to mismatched thermal expansion is a problem that has challenged the electronics packaging industry for decades. Analytical solutions are available in the literature for a tri-material in which the sandwiched layer is an adhesive, but the solutions may not be suitable for a sandwiched layer consisting of discrete elements such as solder joints which experience significant bending. In this paper, closed-form analytical solutions have been developed for both continuous and discrete sandwiched layers by modelling the interconnects as a slab of spring elements capable of transferring axial, shear, and bending load. The analytical solutions have been successfully validated with finite element analysis.
No takes yet. Share an insight, caveat, or question.
Wong et al. (2009) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: