An assembly technique is presented to realize pluggable or fully integrated optoelectronic systems based on image relays. A method to visually align and assemble optoelectronic chips or fiber bundles to half of a relay is explained. To validate this technique, two-dimensional arrays of vertical-cavity surface-emitting lasers and photodetectors and a fiber image guide have been integrated to gradient index lenses with simple optomechanical parts. Although the connection of these modules was realized with +/-0.5 mm lateral tolerances, parallel optical interconnects were successfully achieved at 10 MHz. The lateral misalignment between chips was on average 20 microm and at worst 60 microm.
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Goulet et al. (2002) studied this question.
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