Impact of film structure on damage to low-kSiOCH film during plasma exposure

Shigeo Yasuhara; Juhyun Chung; Kunitoshi Tajima; Hisashi Yano; S. Kadomura; Masaki Yoshimaru; Seiji Samukawa

doi:10.1088/0022-3727/42/23/235201

November 9, 2009Journal of Physics D Applied Physics

Impact of film structure on damage to low-kSiOCH film during plasma exposure

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Key Points

Investigate how the structural properties of low-k SiOCH dielectric films influence the extent of damage sustained during plasma exposure in semiconductor manufacturing.
Exposed low-k SiOCH films of varying structural compositions to plasma environments.
Characterized structural modifications and dielectric degradation resulting from the plasma treatment.
Plasma exposure induced structural damage and material degradation within low-k SiOCH dielectric layers.
Susceptibility to plasma-induced damage varied depending on the underlying structural characteristics of the SiOCH film.

Implication

Experimental study demonstrates plasma-induced damage variations in low-k SiOCH films, indicating structural influences on dielectric reliability.

Abstract

Impact of film structure on damage to low-k SiOCH film during plasma exposure, Yasuhara, Shigeo, Chung, Juhyun, Tajima, Kunitoshi, Yano, Hisashi, Kadomura, Shingo, Yoshimaru, Masaki, Matsunaga, Noriaki, Samukawa, Seiji

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Cite This Study

Yasuhara et al. (2009) studied this question.

synapsesocial.com/papers/6a8d15670065a8c39bcdbb91 https://doi.org/10.1088/0022-3727/42/23/235201

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Impact of film structure on damage to low-kSiOCH film during plasma exposure

Key Points

Implication

Abstract

Discussion

Cite This Study

Impact of film structure on damage to low-kSiOCH film during plasma exposure

Key Points

Implication

Abstract

Discussion

Cite This Study

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