Effect of Annealing Temperature on Dielectric Constant and Bonding Structure of Low-k SiCOH Thin Films Deposited by Plasma Enhanced Chemical Vapor Deposition, Lee, Sungwoo, Yang, Jaeyoung, Yeo, Sanghak, Lee, Jaewon, Jung, Donggeun, Boo, Jin-hyo, Kim, Hyoungsub, Chae, Heeyeop
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Lee et al. (2007) studied this question.
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