Failure analysis (FA) plays a vital role in the development and manufacture of integrated circuits. However, instrumental limits are already threatening FA in the tenth-micron CMOS realm, and nanoelectronic devices will find key analytical tools two orders of magnitude removed in capability. This paper will introduce state-of-the-art microelectronic failure analysis processes, instrumentation, and principles. It will discuss the major limitations and future prospects determined from industry roadmaps. Specifically highlighted is the need for a fault isolation methodology for failure analysis of fully integrated nanoelectronics devices.
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David P. Vallett (2002) studied this question.
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