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A novel method for sputtering insulators in the plasma of a low-pressure discharge is described. The method utilizes rf fields whereby the positive charge accumulation at the target surface, resulting from positive ion bombardment, is periodically neutralized during each cycle. The method has many useful applications for cleaning, etching, and sputtering of insulators, as well as for removing deposits from observation windows.
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Anderson et al. (1962) studied this question.
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