A one-mask process technology is proposed to fabricate silicon capacitive accelerometers using comb drive structures. A doped silicon wafer is anodically bonded on Pyrex glass substrate. High aspect ratio silicon accelerometer structures are micromachined using deep reactive ion etching (DRIE) and released from the glass substrate by further DRIE due to its notching effect.
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Iliescu et al. (2003) studied this question.
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