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November 1, 2008IEEE Transactions on Advanced Packaging

Polymer-Waveguide-Based Board-Level Optical Interconnect Technology for Datacom Applications

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Authors

RDR. DangelIBM Research - ZurichCBChristoph BergerKepler UniversitätsklinikumRBR. BeyelerIBM (United States)

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Dangel et al. (2008) studied this question.

synapsesocial.com/papers/6a90dde91cb9ea1c853e75b5https://doi.org/10.1109/tadvp.2008.2005996
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