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Inorganic Materials V: Insulating dielectric materials which prossess a high thermal conductivity are required for the dissipation of heat from electrical and electronic equipment. As dissippation requirements increase with the miniaturization of circuitry, materials such as diamond, boron nitride, and silicon carbide are being used to replace alumina. The various materials and their applications are discussed.
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Graham Partridge (1992) studied this question.
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