The role of plastic package adhesion in performance

The relationship between plastic package adhesion and semiconductor device performance is discussed. It is a general belief that better adhesion between the encapsulant, leadframe, and the silicon chip will result in improved reliability, resistance to package cracking, and reduced line movement due to thermal stresses. Adhesion is investigated from the viewpoints of thermodynamics, rheology, and processing conditions. The relationship between adhesion characteristics and copper oxide morphological structures and copper chemical treatments is investigated. Various adhesion test methods are evaluated, including conventional destructive tests and nondestructive scanning acoustic microscopy (SAM) analyses.>