The simulation is presented of ballistic deposition of sputtered metal deposited over a via. The step coverage of the film is determined and surface profiles provided at different film thicknesses. The use of a ballistic deposition technique provides additional information unattainable through the use of conventional film deposition simulations. A density profile of the film is produced and the columnar microstructure analyzed.>
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Westra et al. (1989) studied this question.
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