Structural design of photosensitive polyimide with aqueous development and low curing temperature

Photosensitive polyimide (PSPI) has attracted extensive attention in advanced packaging due to its excellent properties. It serves as a key material widely used in semiconductors, integrated circuits, and display devices. However, materials for advanced packaging are currently required not only to achieve low-temperature curing but also to rely on aqueous development for high resolution and reduced environmental hazards. Nevertheless, existing studies on photosensitive polyimides that adopt water-soluble polyimide for aqueous development to realize low-temperature curing still fail to meet the application requirements of advanced packaging.To this end, this study proposes a structural design strategy for polyimide that is soluble in both organic solvents and water. Combined with diazonaphthoquinone (DNQ), a photosensitive polyimide system is constructed to simultaneously achieve high resolution (2 μm) and low-temperature curing. The polyimide film can be fully cured at only 140°C while retaining the inherent excellent properties of polyimide.The dual-soluble (organic solvent/water) structural design strategy for photosensitive polyimide proposed in this work can not only solve the problem of low-temperature curing but also enable aqueous development.