Integration of a resonant-tunneling structure with a metal-semiconductor field-effect transistor

We report experimental realization of a three-terminal negative differential resistance (NDR) device. The device consists of a GaAs-AlxGa1−xAs double-barrier tunneling heterostructure in series with a recessed-gate metal-semiconductor field-effect transistor on a semi-insulating substrate. Basic dc characteristics for three samples grown by metalorganic chemical vapor deposition are shown. All samples exhibit NDR at 77 K, with peak-to-valley current ratios between 2 and 7. Current densities at the peak of the NDR range from 0.5 to 380 A/cm2. The peak-to-valley current ratio and the voltage location of the NDR can be modulated with gate bias.