This letter reports a metal-insulator-semiconductor structure based on Al/sub 2/O/sub 3//TiO/sub 2/ nanolaminates and AlTiO films evaporated on an unheated p-Si substrate. The structure exhibits a low hysteresis in the capacitance-voltage characteristics, a larger dielectric constant leading to a quantum mechanically corrected effective oxide thickness of 1.35-2.1 nm, good stability of the electrical characteristics to thermal processes, a large breakdown electric field of 7.5 MV/cm, and a leakage current density below 5/spl times/10/sup -7/ A/cm/sup 2/ at an electric field of 2 MV/cm.
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Mikhelashvili et al. (2006) studied this question.
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