Evidence and Understanding of ALD<tex>hbox HfO₂hbox --hbox Al₂hbox O₃</tex>Laminate MIM Capacitors Outperforming Sandwich Counterparts

Metal-insulator-metal capacitors with atomic-layer-deposited HfO2-Al2O3laminated and sandwiched dielectrics have been compared, for the first time, for analog circuit applications. The experimental results indicate that significant improvements can be obtained using the laminated dielectrics, including an extremely low leakage current of 1×10/sup -9/ A/cm2at 3.3V and 125/spl deg/C, a high breakdown electric field of /spl sim/3.3MV/cm at 125/spl deg/C, good polarity-independent electrical characteristics, while retaining relatively high capacitance density of 3.13 fF/μm2as well as voltage coefficients of capacitance as low as -80 ppm/V and 100 ppm/V2at 100 kHz. The underlying mechanism is likely due to alternate insertions of Al2O3layers that reduce the thickness of each HfO2layer, hereby efficiently inhibiting HfO2crystallization, and blocking extensions of grain boundary channels from top to bottom as well as to achieve good interfacial quality.