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To date, silicon backplane spatial light modulators have been characterized by poor-quality mirrors. Hillock formation during metal sintering has been identified as the source of this problem. Here hillock elimination is achieved by constraining the metal with a low-temperature plasma-enhanced chemicalvapor deposition silicon dioxide coating. A double-layer metallization procedure increases the silicon area available for circuitry and improves the mirror fill factor. Second-layer metal mirrors require a flat, intermediate dielectric substrate. Chemical-mechanical polishing is demonstrated to provide the flatness necessary to achieve high optical quality.
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O’Hara et al. (1993) studied this question.
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