Bonding Organic Molecules to Hydrogen‐Terminated Silicon Wafers

A platinum catalyzed hydrosilation reaction between 3,4,‐dichlorobutene and the hydrogen‐terminated (100) Si surface was used to bond dichlorobutane molecules to silicon wafers treated with dilute HF acid. In situ infrared, x‐ray photoelectron spectroscopy, and time‐of‐flight secondary ion mass spectroscopy were used to characterize the modified silicon surfaces. The results from this investigation indicate that 3,4,‐dichlorobutene reacts with surface silicon hydride groups to yield 3,4,‐dichlorobutane, which bonds to the surface via Si‒C bonds. This work demonstrates that organic molecules can be selectively patterned onto hydrogen‐terminated silicon wafers using standard microelectronic patterning methods.