Impact of Bottom-Gate Biasing on Implant-Free Junctionless Ge-on-Insulator n-MOSFETs

In this letter, we have fabricated Ge-on-insulator (Ge-OI) junctionless (JL) n-MOSFETs via wafer bonding and epitaxial lift-off (ELO) techniques. We have evaluated the electrical characteristics of Ge-OI JL n-MOSFETs with different thickness of Ge channel carefully thinned by the digital etching. Furthermore, the impact of bottom-gate biasing on the Ge-OI JL n-MOSFET devices with different Ge channel thicknesses has been demonstrated. High effective electron mobility (μ eff) of 160 cm2/V · swas obtained from a Ge-OI JL n-MOSFET with an 18 nm-thick Ge channel and subthreshold slope (S.S.) of 230 mV/dec was extracted on an even thinner 10-nm-thick Ge-OI JL n-MOSFET. Also, due to the stronger coupling between the channel and bottom-gate, we demonstrated higherVₜₕtunability and improvement ofμ effby bottom-gate biasing.