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Summary: New epoxy materials are needed with low dielectric constants (Dk or εr), low loss (Df or tan δ) in the giga‐hertz frequency range and high glass transition temperatures (Tgs) for next generation fiber reinforced printed circuit boards. In this work, the incorporation of adamantane into an epoxy network has been investigated. In particular, this has been achieved by means of a new adamantane‐based, tetra‐functional crosslinking agent (1,3,5,7‐tetrakis(4‐aminophenyl)adamantane or TAPA) which was specifically synthesized and subsequently characterized for this study. The properties of EPON Resin 828 cured with the newly synthesized TAPA have been compared with the commonly used commercial curing agent 4,4′‐diaminodiphenylsulfone (DDS). It was found that the epoxy polymer cured with TAPA exhibited superior thermal properties as well as a good dielectric performance at high frequencies. magnified image
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Qian et al. (2004) studied this question.
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