A systematic approach to quantifying the viscosity and flow coverage, thermal expansion, modulus, glass transition temperature, filler size, alpha activity, adhesion, ionics content, fracture toughness, and electrical properties of low-thermal-expansion encapsulants is presented. The various test methods and their relevant technical aspects are discussed. Results achieved on a few selected materials are presented as examples.>
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Suryanarayana et al. (1993) studied this question.
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