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The formation of thermal donors in silicon is investigated using Czochralski silicon crystals grown with different grown-in defect regions, such as voids and nuclei of oxidation-induced stacking faults. It was found that the formation rate of thermal donors during annealing at 450 °C increases with an increase in the density of oxide precipitates in the regions containing different grown-in defects. The thermodynamic model for the formation of thermal donors shows that the electrically inactive oxygen trimers as nuclei of thermal donors in an as-grown crystal increase with an increase in the density of oxide precipitates, suggesting that the formation of the nuclei is enhanced due to silicon self-interstitials emitted by oxygen precipitations during the crystal growth.
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Torigoe et al. (2020) studied this question.
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