A Low-Loss Bandpass Filter With Stacked Double-Layer Structure Using Glass-Based Integrated Passive Device Technology

In this letter, a third-order low Insertion loss bandpass filter (BPF) is proposed by using a stacked double-layer structure through the technologies of the glass-based integrated passive device (IPD) and the through glass vias (TGVs). First, a stacked multi-layer structure was introduced to create a 3D-inductor of large inductance with a high Q factor. Then, an air cavity Metal-Insulator-Metal (MIM) structure was used to upgrade the Q factor of the capacitor. Therefore, a third-order low-loss small-sized bandpass filter can be generated by utilizing these LC elements of high Q factors. Experimental results show that the proposed BPF’s size and insertion loss is0.018λ _0 × 0.013λ _0and 0.81 dB, respectively. In comparison with the existing design, the proposed BPF shows the superior advantages of smaller size and lower insertion loss.