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Use of Novel Hydrofluorocarbon and Iodofluorocarbon Chemistries for a High Aspect Ratio Via Etch in a High Density Plasma Etch Tool, Karecki, Simon, Pruette, Laura, Reif, Rafael, Sparks, Terry, Beu, Laurie, Vartanian, Victor
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Karecki et al. (1998) studied this question.
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