We present the development of a technological platform dedicated to 3D capacitive inertial sensors. The proof of concept will be made on a 3D gyroscope. The mobile structure is made within a 30 µm thick Si top layer of a SOI substrate, while poly-Si deposited on top of a sacrificial PSG layer serves as suspended top electrodes and connection wires. This technology enables us to maintain low parasitic capacitance, which is of paramount significance for capacitive detection. After packaging and association with an analogue electronic board, functionality of the sensor is demonstrated.
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Walther et al. (2013) studied this question.
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