We use synchrotron x-ray diffraction to characterize the roughness of the buried Si(001)/SiO2 interface, for three types of oxide, without modification of the interface. We show that the thermal oxide interface is 0.5±0.1 times as rough as the native oxide interface, suggesting that the oxide growth decreases the roughness slightly. We also measure the roughness of a chemically grown oxide interface.
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Tang et al. (1993) studied this question.
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