Influence of Cu(II) Ion Concentration on Copper Electrodeposition from Deep Eutectic Solvent on Inert Substrate

The electrochemical behavior of copper (II) on glassy carbon from an eutectic mixture of choline chloride (ChCl) and ethylene glycol (EG) was investigated using cyclic voltammetry (CV). The redox and deposition processes were studied for electrolyte concentrations of 0.01 M and 0.5 M Cu(II), with particular attention paid to the effects of different Cu(II) concentrations on the copper deposition potential and morphology of the copper deposits. The CV results showed that the Cu(II) species are reduced to Cu(0) via two separate steps. Higher Cu(II) concentrations in the electrolyte triggered the formation of differently coordinated Cun+ complexes next to the electrode, which shifted the electrodeposition potential of Cu(I)/Cu(0) couples towards more positive values. The Cu deposits were obtained potentiostatically from 0.01 M and 0.5 M Cu(II)-ChCl:EG electrolyte and analyzed using scanning electron microscopy, energy-dispersive X-ray spectroscopy, and X-ray diffraction. The different copper concentrations in electrolytes induced different morphologies of electrodeposited copper, where the mixture of irregular grains and carrot or needle-like dendrites was obtained from 0.01 M, and rose-like forms were obtained from 0.5 M electrolytes. This study is the first to identify these rose-like forms and the mechanism of their formation, which is discussed in detail.