Excellent thermal conductivity and dielectric properties of polyimide composites filled with silica coated self-passivated aluminum fibers and nanoparticles

A polymer based composite was prepared by using modified aluminum fibers and aluminum nanoparticles as fillers in polyimide matrix that resulted in the high thermal conductivity and low relative permittivity. It was found that silica coated aluminum fibers with the multilayer coating structures can significantly reduce the relative permittivity (about 19.6 at 1 MHz) of the composite while keeping lower dielectric loss (0.024 at 1 MHz). The thermal conductivity of composites was significantly increased to 15.2 W/m K. This work shows a useful way to choose proper modifier fillers to improve the composite properties for electronic packaging composite materials.