Enabling high-performance transparent photovoltaics through atomic layer deposition techniques

Transparent photovoltaics (TPVs) offer a promising pathway for integrating solar energy harvesting into windows, façades, greenhouses, and wearable electronics while preserving visible-light transmission. However, achieving a balance between power-conversion efficiency, transparency, color neutrality, and long-term stability remains a major challenge. This article critically examines the role of atomic layer deposition (ALD) as an enabling technology for addressing these limitations in organic, perovskite, dye-sensitized, silicon-based, and tandem transparent photovoltaic systems. Particular emphasis is placed on ALD-enabled transport layers, interface engineering, defect passivation, carrier-selective contacts, and encapsulation strategies. The mechanisms by which ALD suppresses interfacial recombination, improves band alignment, mitigates ion migration, and enhances environmental stability are critically discussed. The advantages and limitations of ALD are evaluated through comparative analysis with other thin-film deposition techniques, highlighting its suitability for ultrathin functional layers and interface engineering. Finally, remaining challenges related to cost, throughput, precursor development, and scalability are evaluated, together with emerging opportunities offered by plasma-enhanced, spatial, atmospheric-pressure, and roll-to-roll ALD for large-area TPVs commercialization.