What question did this study set out to answer?

To establish a passive alignment and coupling method between an InGaAsP/InP semiconductor laser array and single-mode optical fibers using a micromachined silicon platform.

June 6, 1991Electronics Letters

Passive coupling of InGaAsP/InP laser array and singlemode fibres using silicon waferboard

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Authors

CACraig ArmientoRTX (United States)MTM. TabaskyAEgis Technologies (United States)CJC. JagannathUnited States Naval Research Laboratory

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Implication

Experimental study demonstrates passive alignment of laser arrays to singlemode fibers using silicon waferboards, highlighting a path toward low-cost optoelectronic packaging.

Key Points

To establish a passive alignment and coupling method between an InGaAsP/InP semiconductor laser array and single-mode optical fibers using a micromachined silicon platform.
Fabricated precise mechanical alignment features and V-grooves on a silicon waferboard substrate.
Mounted four single-mode fibers into the substrate grooves to passively align with the active regions of an InGaAsP/InP laser array without dynamic optical feedback.
Demonstrated passive multi-fiber alignment between semiconductor laser arrays and single-mode fibers on a micromachined substrate for the first time.
Attained optical coupling efficiency qualitatively comparable to traditional active fiber manipulation techniques.

Cite This Study

Armiento et al. (1991) studied this question.

synapsesocial.com/papers/6a97f1cf78a91a1f562d33d2 https://doi.org/10.1049/el:19910689

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June 6, 1991Electronics Letters

Passive coupling of InGaAsP/InP laser array and singlemode fibres using silicon waferboard

View Full Paper

Ask AI

Bookmark

Authors

CACraig ArmientoRTX (United States)MTM. TabaskyAEgis Technologies (United States)CJC. JagannathUnited States Naval Research Laboratory

Discussion

Member takes

Implication

Experimental study demonstrates passive alignment of laser arrays to singlemode fibers using silicon waferboards, highlighting a path toward low-cost optoelectronic packaging.

Key Points

To establish a passive alignment and coupling method between an InGaAsP/InP semiconductor laser array and single-mode optical fibers using a micromachined silicon platform.
Fabricated precise mechanical alignment features and V-grooves on a silicon waferboard substrate.
Mounted four single-mode fibers into the substrate grooves to passively align with the active regions of an InGaAsP/InP laser array without dynamic optical feedback.
Demonstrated passive multi-fiber alignment between semiconductor laser arrays and single-mode fibers on a micromachined substrate for the first time.
Attained optical coupling efficiency qualitatively comparable to traditional active fiber manipulation techniques.

Cite This Study

Armiento et al. (1991) studied this question.

synapsesocial.com/papers/6a97f1cf78a91a1f562d33d2 https://doi.org/10.1049/el:19910689

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