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Photosensitive cycloaliphatic‐epoxy oligosiloxane was synthesized using a nonhydrolytic sol–gel reaction for the fabrication of thick and thermally stable microstructures with high aspect ratios. Its formation was confirmed by 29Si and 1H nuclear magnetic resonance spectroscopy, small‐angle neutron scattering, and Fourier transform infrared spectroscopy. Photocuring of cycloaliphatic‐epoxy oligosiloxane resin resulted in a thermally stable epoxy hybrid material (epoxy hybrimer). Micropatterns with a high aspect ratio (>5), an excellent sidewall shape, and low shrinkage were fabricated directly from these materials using a simple photolithographic process. The fabricated micropattern sustained temperatures of up to 250°C.
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Jung et al. (2008) studied this question.
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